Glossary Table B
| B-Stage Material: Sheet material impregnated with resin cured to an intermediate stage. Also referred to as pre-peg. |
| Back Bonding: Process of bonding active chips to the substrate using the back of the chip, leaving the face with the circuitry face up. |
| Backplanes or Backpanels: Multi-layer printed circuit boards typically used to connect other boards. |
| Ball Grid Array (BGA): An integrated circuit package in which the input and output solder points are solder bumps arranged in grid pattern. Also known as a bumped grid array. |
| Bare Board: An unpopulated printed circuit board. |
| Bed-Of-Nails Test Fixture: A vacuum or mechanically activated test fixture designed to make electrical contact with assigned printed circuit board nodes. Used in testing production volume printed circuit boards to detect defective components or connections. |
| Bill of Materials (BOM): A detailed list of all the necessary sub-assemblies, components, and raw materials for an assembly. |
| Blind or Buried Vias: Holes within complex printed circuit boards connecting outer layers to inner layers, but not continuing through to the outer side. Also known as buried via. |
| Blister: Delamination in localized areas of a printed circuit board. |
| Blow Hole: A void caused by outgassing. |
| Board Cleaner: A production line machine used to remove solder residue and other foreign material acquired during assembly from the printed circuit board. |
| Bonding Wire: Fine gold or aluminum wire between bonding pads on a semiconductor and base lands. |
| Branched Conductor: Any conductor on a printed circuit board that connects electrically to more than 2 leads. |
| Breadboard Model: An assembly design to prove the feasibility of a circuit, system, or principle. |
| Bridge: Solder that spans or “bridges” across two conductors that should not be electrically connected, causing a short. |
| Built-In Self Test: An electrical testing method that enables devices to test themselves. |
| Buried Via: A via that connects inner layers of a printed circuit board but is not visible from the outer layers. Also referred to as a blind via. |
| Burn-In Testing: A product functionality test that powers products for an extended period intended accelerate the aging of a device, stabilize device characteristics and detect early failures. |
| BUS: Electrical connections between integrated circuits and peripheral semiconductors. |