Glossary Table T
| Tape Automated Bonding: An assembly process involving the application of components onto a circuit board using temperature and pressure. |
| Taped Components: Components attached to a continuous tape for use in automatic assembly. |
| Temperature Coefficient (TC): The ratio of a quantity change of an electrical parameter of an electronic component from its original value when temperature changes. |
| Termination: The part of a component that makes electrical contact with the printed circuit board. |
| Test Point: A specific point on a circuit board used for functionality or quality testing. Three-Dimensional |
| Laser Paste: An inspection method using microscopes with lasers. |
| Thru-Hole Process: A method of soldering where components are first placed in holes in the PCBs at points where they are to be soldered. The hole is then filled with solder to complete the process. |
| Tinning: Coating of a terminal, lead, or conductive pattern with tin or solder alloy to improve and maintain solderability. |
| Tombstoning: Soldering defect in which a chip component is pulled into a vertical or near vertical position with only one termination soldered to the printed circuit board. Typically caused by force imbalances during the reflow process. |
| Trace: A thin conductive area on a printed circuit board composed of paths and lands to which component leads are connected. |
| Transfer: Movement of product into, across, and then out from the machine conveyor. |
| Transfer Conveyor: Incorporates intelligent control like a PLC (Programmable Logic Controller) or computer to control the movement of boards or product. |
| Transfer Workstation: An Edge Carry or Flat Belt conveyor that incorporates a work surface, light and shelf for easy human interface with product as it passes on the line. |
| Turn-key: An outsourcing model which turns all aspects of electronics manufacturing over to an EMS provider, who buys the raw materials and components and bills the OEM for a complete assembly. |