GF-DL-HT Hot Plates
Reflow hot plate used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, digital temperature controllers for precise temperature regulation.
Read the article "Selecting a Reflow Oven."
- 3/4" (19mm) thick aluminum heat plates for precise, even heating
- Temperatures up to 315°C (600°C) for soldering with lead-free solder alloys
- Lead and Lead-free compatible
- CE compliant
- RoHS compliant
| Power | 900 W each plate |
| Temperature Range, standard model | 37° to 315°C (100° to 600°F) |
| Heating Area | Two 13" x 6.5" (330mm x 163mm) |