GF-SL-HT Hot Plates
Used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-SL-HT is capable of lead and lead free, high temperature applications, with a programmable, digital controller for precise temperature regulation.
Read the article "Selecting a Reflow Oven."
- 3/4" (19mm) thick aluminum heat plates for precise, even heating
- Temperatures up to 315°C (600°F) for use with lead-free solder alloys
- Lead and Lead-free compatible
- CE compliant
- RoHS compliant
| Power | 1800 W |
| Temperature Range, standard model | 37° to 315°C (100° to 600°F) |
| Heating Area | 13" x 13" (330mm x 330mm) |