>Through-Hole Systems
GW-10A-HT Soldering Fountain
High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.
Read the article "Selecting a Wave Soldering System."
- Microprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
- 10 menu storage
- Overhead locator laser light pinpoints position for centering components over the wave
- Height adjustable stainless steel platform
- Large selection of nozzles for all component sizes
- Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications
- "Blow-thru" hot air nozzle option removes solder remaining in through holes during rework process
- High temperature (350°C), compatible with lead-free operation
- Universal X, Y, & Z Board Fixture Option for board sizes up to 11" x 16.5" (280 x 420mm)
| Solder type | Hi-temp Lead-free |
| Max solder temp | 662°F (350°C) |
| Solder capacity | 50 lbs (23Kg) |
| Blow-thru air nozzle | Yes |
| Compressed Air Required | 60 psi (4 bar) |
| Overall dimensions | 16" x 26" x 17" (406mm x 660mm x 432mm) |
| Board Size | 8.5" to 18" (203mm to 457mm) L x 16" (406mm) Depth |