GF-B-HT Reflow Oven
Cost-effective compact batch reflow oven provides forced air convection heating technology with individual time and temperature controls to make profile set up quick and easy. The single zone GF-B-HT comes in a table-top configuration or with an optional stand. It has a high temperature model capable of lead and lead-free soldering and 2 cooling stations making it the best reflow oven for the money.
This unique PCB shuttle system enables a higher throughput than standard batch ovens. Both sides of the oven have a cooling station. While one board is being processed, another board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow.
Read the article "Selecting a Reflow Oven."
- Low-cost reflow oven best for small batch runs and prototypes.
- Large window allows the operator to see the board throughout the entire reflow process
- Unique shuttle system enables higher throughput than standard batch ovens
- All stainless steel interior construction provides for years of useful life
- Nitrogen gas inerting option available
- Maximum board size is 12" x 12" (305mm x 305mm)
- Compatible with lead and lead-free soldering applications
| Max board width | 12" x 12" (305mm x305mm) |
| Max board height | 1.250" (32mm) |
| Heating zones | One (1) |
| Max temperature | 315°C (600°F) |
| Heat tunnel length | NA |
| CyclonicsTM (forced air) | One (1) |
| Conveyor extensions | Dual board shuttle |
| Cooling station(s) | Two (2) |
| Venting | 4" (102mm) flange with integral fan |
| Cooling Zone Venting | N/A |
| Nitrogen option | Yes |
| PC Interface | No |
| Overall dimensions (L x W x H) | 38.13" x 28.13" x 14.5" (968mm x 715mm x 368mm) |